Shenzhen Antenk Electronics Co., Ltd. promoted a 2.54mm Dual-in-line Socket Straight DIP (H=3.0) connector product.
Currently, the board-to-board connectors used on mobile phones have the following characteristics:
First of all, "soft", flexible connection, and has a strong corrosion resistance; secondly, no welding is required, installation is convenient, and there is no fire hazard, which saves space; in addition, today's board-to-board is Ultra-low height, two-piece, this point below, Xiaobian will focus on; the final is to have superior environmental resistance, not only soft, but also use a "sturdy connection" with high contact reliability; of course, generally have no Limited pipe, with pressure sealing, easy installation and so on.
Current Rating: 1.0Amp
Contact Resistance: 10MΩ max
Dielectric Strength: Min 1000 V RMS
Mechanical Life: Min 100 cycles
Operating Temperature: -40°C to +105°C
Sleeve: Brass CuZn36Pb3(C36000)
Contact Clip(4 finger): BeCu(C17200)
Contact Plating: Au or Sn Over Ni
Insulator Material: PPS+30%GF UL 94V-0
06p~16P Insulators without center bar
36p~52P Insulators with center two bar
64P Insulators with center three bar
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