USB 3.1 C TYPE SMT FINISHED PCB LAYOUT

USB 3.1 C TYPE COUNTERSINK 0.80 SMT FINISHED PRODUCT 7.90L PCB LAYOUT

SPECIFICATIONS:
1.MOLDING:LCP UL94 V-0
CONTACT:COPPER ALLOY
   GOLD PLATED MIN ON CONTACT AREA 100U"   
   MIN TIN(LEAD FREE)ON SOLDER AREA
SHELL:SUS304-H,T+0.30±0.03MM
   50U"NICHEL PLATING OVER ALL
SHILD:SUS304-H,T+0.12±0.03MM
2.MECHANICAL:
   INSERTION:5N-20N
   EXTRACTION:8-20N AFTER TEST
   DURABILITY:10000CYCLES
3.ELECTRICAL:
   CURRENT:5A FOR VBUS
           1.25A FOR GND PIN
           0.25A FOR OTHER
   VOLTAGE:20V MAX
   WITHSTANDING VDLTAGE:100V AC R.M.S
   COMTACT RESISTANCE:40MΩ MAX
   INSULATION RESISTANCE:100MΩ MIN
4.ENMPONMENTAL
   TEMPERATURE RANGE -25°C~+85°C